[Eng Sub] Wafer Bumping Process: Solder bump, Cu pillar bump, UBM Semicon Talk 4:28 3 years ago 50 048 Скачать Далее
Automated Solder Bumping Machine with Ultra-SB² 300 by PacTech | Advanced Packaging Equipment PacTech GmbH 2:09 2 years ago 2 828 Скачать Далее
Spherolyte® Cu UF 5 – next generation copper pillar plating for speed, purity and shape control Atotech an MKS Brand 0:41 2 years ago 1 095 Скачать Далее
[Eng Sub] Flipchip die attach process: Bump, MR(Mass Reflow), TCNCP, LAB(Laser Assist Bond), NCP Semicon Talk 5:27 3 years ago 35 838 Скачать Далее
Advanced under-bump metallization (UBM) with the AP&S e-less tool Vulcanio AP&S International GmbH 0:50 3 years ago 633 Скачать Далее
